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STTH812
Ultrafast recovery - 1200 V diode
Main product characteristics
A K
IF(AV) VRRM Tj VF (typ) trr (typ)
8A 1200 V 175 C 1.25 V 50 ns
A K
TO-220AC STTH812D
A K
TO-220FPAC STTH812FP
Features and benefits

Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated packages: - TO-220Ins Electrical insulation = 2500 VRMS Capacitance = 7 pF - TO-220FPAC Electrical insulation = 2000 VRMS Capacitance = 12 pF
K A K
TO-220Ins STTH812DI
A NC
D2PAK STTH812G
Order codes
Part Number Marking STTH812D STTH812G STTH812G STTH812FP STTH812DI STTH812D STTH812G STTH812G-TR STTH812FP STTH812DI
Description
The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device.
March 2006
Rev 1
www.st.com
1/11
11
Characteristics
STTH812
1
Table 1.
Symbol VRRM IF(RMS)
Characteristics
Absolute ratings (limiting values at 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage TO-220AC / D PAK / TO-220FPAC RMS forward current TO-220AC Ins TO-220AC / D2PAK IF(AV) Average forward current, = 0.5 TO-220FPAC TO-220AC Ins IFRM IFSM Tstg Tj Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 140 C Tc = 75 C Tc = 115 C 100 80 -65 to + 175 175 A A C C 8 A 20
2
Value 1200 30
Unit V A
tp = 5 s, F = 5 kHz square tp = 10 ms Sinusoidal
Table 2.
Symbol
Thermal parameters
Parameter TO-220AC / D
2PAK
Value 1.9 5.4 3.1
Unit
Rth(j-c)
Junction to case
TO-220FPAC TO-220AC Ins
C/W
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 8 A 5 50 2.2 IF = 8 A 1.30 1.25 2.0 1.9 V Unit
VF
(2)
Forward voltage drop
Tj = 125 C Tj = 150 C
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.05 IF2(RMS)
2/11
STTH812 Table 4.
Symbol
Characteristics Dynamic characteristics
Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C IF = 8 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C dIF/dt = 50 A/s IF = 8 A VFR = 1.5 x VFmax, Tj = 25 C IF = 8 A, dIF/dt = 50 A/s, Tj = 25 C 7 50 14 2 400 ns V Min. Typ Max. 100 ns 70 21 A Unit
trr
Reverse recovery time
IRM S tfr VFP
Figure 1.
P(W)
20 18 16 14 12 10 8 6
Conduction losses versus average current
= 0.1 = 0.2 = 0.5
Figure 2.
IFM(A)
80 70
Forward voltage drop versus forward current
= 0.05
=1
60 50 40 30
Tj=150C (typical values)
Tj=25C (maximum values) Tj=150C (maximum values)
T
4 2 0 0 1 2 3 4 5 6 7 8 9 10
20 10
IF(AV)(A)
=tp/T
tp
0 0.0 0.5 1.0 1.5 2.0
VFM(V)
2.5 3.0 3.5 4.0 4.5 5.0
Figure 3.
Relative variation of thermal impedance junction to case versus pulse duration
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse TO-220AC D2PAK TO-220Ins
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse TO-220FPAC
tp(s)
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01 1.E+00 1.E+01
3/11
Characteristics
STTH812
Figure 5.
IRM(A)
35 30 25 20 15 10 5
VR=600V Tj=125C
Peak reverse recovery current versus dIF/dt (typical values)
Figure 6.
trr(ns)
500 450
Reverse recovery time versus dIF/dt (typical values)
VR=600V Tj=125C
IF=2 x IF(AV)
IF=2 x IF(AV)
400
IF=IF(AV) IF=0.5 x IF(AV)
350 300 250 200 150 100
IF=IF(AV) IF=0.5 x IF(AV)
dIF/dt(A/s)
0 0 50 100 150 200 250 300 350 400 450 500
50 0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
Figure 7.
Qrr(C)
3.0
VR=600V Tj=125C
Reverse recovery charges versus dIF/dt (typical values)
Figure 8.
S factor
4.0 3.5
Softness factor versus dIF/dt (typical values)
IF 2xIF(AV) VR=600V Tj=125C
2.5
IF=2 x IF(AV)
3.0 2.0
IF=IF(AV)
2.5 2.0 1.5 1.0
1.5
IF=0.5 x IF(AV)
1.0
0.5
dIF/dt(A/s)
0.0 0 50 100 150 200 250 300 350 400 450 500 0.5 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
Figure 9.
Relative variations of dynamic parameters versus junction temperature
IF=IF(AV) VR=600V Reference: Tj=125C
S factor
Figure 10. Transient peak forward voltage versus dIF/dt (typical values)
VFP(V)
45 40 35 30 25
IF=IF(AV) Tj=125C
2.25 2.00 1.75 1.50 1.25 1.00
trr
20 15 10
0.75 0.50 0.25 0.00 25
IRM
QRR
Tj(C)
50 75 100 125
5 0 0 100
dIF/dt(A/s)
200 300 400 500
4/11
STTH812
Characteristics
Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values)
tfr(ns)
700
IF=IF(AV) VFR=1.5 x VF max. Tj=125C
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
600 100 500
400 10 300
dIF/dt(A/s)
200 0 100 200 300 400 500 1 1 10
VR(V)
100 1000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 m)
Rth(j-a)(C/W)
80 70 60 50 40 30 20 10
SCU(cm)
0 0 5 10 15 20 25 30 35 40
5/11
Package mechanical data
STTH812
2
Package mechanical data
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions
DIMENSIONS REF. Millimeters Min.
H2 OI L5 L7 L6 L2 C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
A C D E F F1 G
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
F1
L9 L4 F
D
H2 L2 L4
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
M E G
L5 L6 L7 L9 M Diam. I
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
6/11
STTH812 Table 6. T0-220Ins dimensions
Package mechanical data
DIMENSIONS REF Millimeters Min. A
B OI L F A I4 b2 C
Inches Min. Max. 0.625 0.147
Max.
15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75
15.90 0.598
a1 a2 B b1 b2
14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 5.40 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.189 0.244 0.147
0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151
a1 l2
c2
C c1
a2
c2
M b1 e c1
e F OI I4 L l2 M
15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 1.70 0.104 0.044 0.102 0.116 0.066
7/11
Package mechanical data Table 7. T0-220FPAC dimensions
DIMENSIONS REF Millimeters Min.
A H B
STTH812
Inches Min.
0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393
Max.
4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4
Max.
0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409
A B D
4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10
Dia L6 L2 L3 L5 F1 L4 D L7
E F F1 G G1 H L2 L3
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1
E
L4 L5
G
L6 L7 Dia.
8/11
STTH812 Table 8. D2PAK dimensions
Package mechanical data
DIMENSIONS REF. Millimeters Min.
A
A E L2
Inches Min.
0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094
Max
4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
Max.
0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
A1
C2
A2
D L L3 A1 B2 B R
B B2 C
C
C2 D
G
E
A2
G
M
*
L
V2
L2
* FLAT ZONE NO LESS THAN 2mm
L3 M R V2
0.40 typ. 0 8
0.016 typ. 0 8
Figure 14. D2PAK footprint (dimensions in mm)
16.90
10.30 1.30
5.08
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
STTH812
3
Ordering information
Part Number STTH812D STTH812DI STTH812FP STTH812G STTH812G-TR Marking STTH812D STTH812DI STTH812FP STTH812G STTH812G Package TO-220AC TO-220Ins TO-220FPAC D2 D2 PAK PAK Weight 1.86 g 1.86 g 2.2 g 1.48 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel
4
Revision history
Date 02-Mar-2006 Revision 1 First issue. Description of Changes
10/11
STTH812
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